Product specifications

F8-F220

Scope of application

It can be used for cutting and precision grinding of crystals, precision grinding of hard glass, slicing of single crystal silicon and polycrystalline silicon rods, precision grinding of single crystal silicon wafers, processing of super-hard metals, soft materials such as copper and copper alloys, etc. Processing of high-quality metals, making bonded abrasives and coated abrasives; grinding and polishing, etc.

Products Description

Black silicon carbide is made from quartz sand and petroleum coke as the main raw materials, and is smelted at high temperature in a resistance furnace. It is black crystal, brittle and sharp, and has certain thermal and electrical conductivity. The microscopic shape is hexagonal crystal. The Mohs hardness of silicon carbide is 9.3, the microdensity hardness is 2940--3300 kg/mm2, and the Knoop hardness is 2670-2815 kg/mm2. It is higher than corundum and second only to diamond in abrasives. , cubic boron nitride and boron carbide. The density is generally considered to be 3.20-3.25 g/cm3. The natural packing density of silicon carbide abrasives is between 1.2--1.6 g/cm3, and the specific gravity is 3.20-3.25 g/cm3. ...

Black silicon carbide is made from quartz sand and petroleum coke as the main raw materials, and is smelted at high temperature in a resistance furnace. It is black crystal, brittle and sharp, and has certain thermal and electrical conductivity. The microscopic shape is hexagonal crystal. The Mohs hardness of silicon carbide is 9.3, the microdensity hardness is 2940--3300 kg/mm2, and the Knoop hardness is 2670-2815 kg/mm2. It is higher than corundum and second only to diamond in abrasives. , cubic boron nitride and boron carbide. The density is generally considered to be 3.20-3.25 g/cm3. The natural packing density of silicon carbide abrasives is between 1.2--1.6 g/cm3, and the specific gravity is 3.20-3.25 g/cm3.

Application scope

Main uses: It can be used for cutting and precision grinding of crystals, precision grinding of hard glass, slicing of single crystal silicon and polycrystalline silicon rods, precision grinding of single crystal silicon wafers, processing of superhard metals, and soft metals such as copper and copper alloys. Processing, making bonded abrasives and coated abrasives; grinding and polishing, etc.

Technical Parameters

Commonly used abrasive particle size comparison table

	Particle size distribution (micron)			Chemical indicators			Physical indicators
Granularity number	D3max	Median particle size D50	Minimum particle size D94	SiC ≥(%)	Fe2O3 ≤(%)	F•C ≤(%)	pH value	Bulk density	Magnetic content ≤ (%)
BC#800	≤20.0	14.0±1.0	≥9.0	≥95.00	1.2	0.4	6--8	1.18	0.008
BC#1000	≤18.3	11.5±1.0	≥7.0	≥93.50	1.2	0.4	6--8	1.15	0.008
BC#1200	≤17.5	9.5±0.8	≥5.5	≥93.50	1.2	0.4	6--8	1.13	0.005
BC#1500	≤14.5	8.0±0.6	≥4.5	≥93.00	1.2	0.4	6--8	1.12	0.005
BC#1800	≤13.5	7.0±0.6	≥4.2	≥93.00	1.2	0.4	6--8	1.05	0.005
BC#2000	≤13.0	6.7±0.6	≥4.0	≥93.00	1.2	0.4	6--8	1.00	0.005